Recently WorkingBear got complaint from R&D and ask increase the solder paste volume on the MLCC (Multi-Layer Ceramic Capacitor) component pads to improve the capacitor broken issue. R&D said he had verified that the capacitor’s footprint in the board design is correct and followed manufacturer’s design guidelines. However, looks like there is not enough solder paste to form proper heel fillet on the terminal of capacitor. This insufficient solder paste volume make the solder cracking?
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