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Taiwan #Semiconductor Manufacturing Co. #TSMC, the world's largest contract chipmaker, said on Wednesday that its plan to build an advanced 2 nanometer process wafer plant in Hsinchu and later expand production to Taichung remains unchanged.
https://focustaiwan.tw/business/202106230023
COMPUTEX Opening Keynote by Intel Promoting Innovation Unleashed
Johnston Holthaus, Executive Vice President and Chief Revenue Officer, provided a firsthand look at how the strategies of new CEO Pat Gelsinger, along with the forces of a rapidly accelerating digital transformation, are unleashing a new era of innovation at Intel — right when the world needs it most.
Pat Gelsinger, Intel CEO, mentioned:
📌 Intel is unmatched in its depth and breadth of software, silicon and platforms, packaging and process with at-scale manufacturing. Intel is uniquely suited to innovate around the four key superpowers driving digital transformations: Cloud, connectivity fueled by 5G, artificial intelligence, and the intelligent edge. The company has been working diligently with their partners to increase output to meet demand.
📌 Intel has doubled their internal wafer capacity in the past four years. The Integrated Device Manufacturer, or “IDM” model gives Intel flexibility to address the dynamic market.
▶️Replay this keynote
https://www.youtube.com/watch?v=ATz4TPWdVbk&t=136s
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【Market Commentary】Micron’s 1α process is clearly groundbreaking since it allows for more chips per wafer. Though the process is currently undergoing qualification, TrendForce believes it will be the main driver of DRAM supply bit growth for Micron in 2022.
