《How to use SMT Line to produce a printed circuit board? (3)》
Into the pasta soldering phase, the paste melting and reform the surface mount and electronics components. Meanwhile the solder printing must be maintain in appropriate amount, exact angle, and correct speed. After that the circuit board will into the High-Speed pick & place machine, which is a SMT components placement system. The machine can place the small volume of electronics components in high speed and high precision way, like capacitors, resistors, and integrated circuits onto the circuit board.
In the early 1980’s the high speed pick and place machine separate in two parts: the chip shooter and the machine itself. But the huge cost and inflexibility make them develop new type of all-in-one module, multi-head, gantry machine, that can quickly swapped to different modules. Nowadays, the latest machines even has touchscreen, e-platform, graphical interface, linear motor driven gantry, and the components range can be from 01005 to 80x70 mm, board size up to 600x800 mm, and can use in many industry, such as: consumer goods, electrical industry, medical, automotive equipment.
solder paste type 在 Solder Paste Types and Powder Sizes for SMT and Dispensing 的相關結果
The most common solder paste powder sizes for SMT are type 3 (T3), type 4 (T4), and type 5 (T5). The lower the number, the larger the particle ... ... <看更多>