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lithography半導體 在 [心得] 半導體黃光製程工作內容分享- 精華區Tech_Job 的推薦與評價
(一) 製程概觀
參考書籍: Introduction to Semiconductor Manufacturing Technology by Xiao
半導體製程主要分六個module, 分別是: 微影 (lithography) , 蝕刻 (etching) ,
薄膜 (thin film), 擴散 (diffusion), 離子植入 (ion implant),
與 化學機械研磨 (chemical mechanical polishing).
可以將電晶體的製程想成蓋房子,首先製作STI (shallow trench isolation)區分
發揮電性的silocon與絕緣的silicon oxide.植入離子產生N/P well.製作poly
gate當做電晶體的開關,接著製作contact,填入金屬稱為plug,一層層的metal line
蓋上去成為電路,每層metal layer間以via連接,最後有passivation layer保護.
習慣上把contact以前稱為FEOL (front end of line,前段),contact稱為
MEOL (middle end of line,中段),metal開始稱為BEOL (Back end of line,
後段).
其中,微影也常被稱為黃光,一部分原因是因為光阻中的PAG (photo-induced acid
generator,曝光後產生酸,接著採取連鎖反應.)怕白光,所以無塵室內微影區是以黃
光照明.黃光工程師的工作是以光阻曝光產生固定的pattern後,接著利用蝕刻將其
轉印在晶圓上(如oxide, poly, metal, via layer, layer前的名字代表將產生半導體內
的哪個單位).也有可能是光阻曝光後, 利用implant將ion植入silicon產生電性
(implant layer,其中包含: well, LDD, S/D, cell, I/O).與photo (黃光)合作關係
最密切的就是etch與implant.
(二) 黃光工作內容
(二-1)
參考書籍:
1. Sub-Half-Micron Lithography for ULSls by K.SUZUKI
2. Fundamental Principles of Optical Lithography: The
Science of Microfabrication by Mack
3. Advanced Processes for 193-nm Immersion Lithography
by Y. Wei and R. L. Brainard
4. Optical Lithography: Here is Why by B. J. Lin
5. Microlithography: Science and Technology by K. Suzuki and etl.
在介紹內容之前,要先解釋一下光罩的區別.依據製程與layout的差別,我們將光罩分
為Bright field Dark tone如Oxide, poly layer,與Dark field bright tone如
metal, via layer.簡單的想法就是,以oxide為例,我們要將大部分的光阻都曝開
才能往下etch製作STI,所以稱為bright field.對metal而言,我們是將少部分的光阻
曝開往下etch,接著填入metal,所以稱為dark field.了解這個差別,較容易進
一步了解各個layer所需要的pattern與解defect的recipe的調整.
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